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ADP2323
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Data Sheet
Parameter
PVIN1, PVIN2, EN1, EN2
SW1, SW2
BST1, BST2
FB1, FB2, SS1, SS2,COMP1, COMP2,
PGOOD1, PGOOD2, TRK1, TRK2, SCFG,
SYNC, RT, MODE
Rating
?0.3 V to +22 V
?1 V to +22 V
V SW + 6 V
?0.3 V to +6 V
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Boundary Condition
θ JA is measured using natural convection on a JEDEC 4-layer
board, and the exposed pad is soldered to the printed circuit
board (PCB) with thermal vias.
INTVCC, VDRV, DL1, DL2
PGND to GND
Temperature Range
Operating (Junction)
Storage
Soldering Conditions
?0.3 V to +6 V
?0.3 V to +0.3 V
?40°C to +125°C
?65°C to +150°C
JEDEC J-STD-020
Table 3. Thermal Resistance
Package Type
32-Lead LFCSP_WQ
ESD CAUTION
θ JA
32.7
Unit
°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. A | Page 6 of 32
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